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Minicourse

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Minicourse Description

Plasma Processing Technologies: Industrial Plasma Deposition Technologies, Reactive Ion Etching, Plasma Induced Damage, and Carbon-based Materials Processing

A special two-day minicourse will be offered on Thursday and Friday, 8 and 9 June at the end of the ICOPS conference. The course will be two full days and will tackle issues relevant in modern industry and research in the field of Plasma Processing Technologies. The instructors are highly accomplished plasma research experts from industry, national laboratories, and universities who will relate their knowledge in the areas of thin film deposition, reactive ion etching, plasma induced damage in ULSI manufacturingand the emerging field of carbon-based materials processing.

The first session of the course (Day 1) will cover the funda- mentals of vacuum and plasma processing technologies with the main focus on plasma enhanced chemical and physical vapor deposition technologies.

Two separate sessions will run simultaneously on the second day. These sessions, instructed by industry experts, will highlight plasma processing technology expertise from industry, e.g. semiconductor manufacturing and hard coatings industries. For example, one of the Day 2 sessions will deal with ULSI manufacturing issues and technologies such as reactive ion etching and plasma induced damage, which has become increasingly important with shrinking design rules and gate dielectric thickness.

Finally, the other Day 2 session will focus on carbon based materials and related processing technologies which includes a variety of applications and industries. It will cover the synthesis of diamond and diamond-like carbon materials and involves a thorough discussion of processes and equipment technology. The session will conclude with a discussion on microstructuring of carbon materials for MEMS and similar applications.

Minicourse Topics

Session 1

  • Basics - Vacuum and Plasma Processing Technologies
  • Chemical Vapor Deposition
  • Atmospheric Pressure CVD
  • Physical Vapor Deposition
  • Pulsed Plasma Processing
  • Reactive Ion Etching

Session 2A

  • Plasma damage to semiconductor manufacturing
  • Mechanism of plasma damage
  • Plasma diagnostics for plasma damage

Session 2B

  • CVD Diamond - Synthesis and Applications
  • Diamond-like carbon - Synthesis and Applications
  • Microstructuring of carbon
  • Industrial plasma based carbon processing equipment

Instructors

Dr. Volkmar Hopfe, Department Head - CVD Thin Film Technology, Fraunhofer Institute for Materials and Beam Technologies, Germany

Expertise is in the areas of atmospheric pressure plasma processes, chemical vapor deposition, plasma etching, plasma process monitoring and quality control, plasma spectroscopy, atmospheric pressure equipment design and simulation.

Shawming Ma, Senior Engineering Manager at Applied Materials in the Dielectric Etch Division, Etch Product Business Group.

He specializes in the area of plasma damage for process optimization, device testing and plasma chamber design and has more than 14 years experience in this field.

Steven Shannon, Applied Materials in the Dielectric Etch Emerging Technologies Group.

Expertise includes design and development of plasma tools for next generation dielectric etch applications, enhanced optical emission spectroscopy systems for plasma monitoring, multi- frequency driven plasma sheaths and their application to next generation plasma etch processes.

Andre Anders, Lawrence Berkeley National Laboratory.

Expertise includes vacuum arc plasma and ion sources, gas plasma sources, ion implantation, plasma immersion ion implantation, thin film synthesis, and pseudosparks. He is the author of A Formulary for Plasma Physics (Akademie, Berlin, 1990) and more than 100 scientific papers.

Thomas Schuelke, Division Manager of the Fraunhofer USA Center for Coatings and Laser Applications.

Expertise is in the areas of plasma-based processes for thin film deposition and etching, surface analysis, and equipment design. He is responsible for Fraunhofer USA's activities in the area of advanced coating technologies.

Jes Asmussen, Distinguished Professor, Electrical and Computing Engineering at Michigan State University.

Expertise includes the invention, diagnosis and the application of microwave plasma free radical sources, microwave broad-beam ion sources, microwave plasma thin film deposition and microwave plasma etching techniques, microwave ion engines and microwave electrothermal engines for spacecraft propulsion and specialized microwave applicators for processing layered polymeric and/or composite materials.

Tim Grotjohn, Professor and Acting Department Chair of Electrical and Computing Engineering at Michigan State University.

His expertise includes the modeling, design, diagnostics, and control of microwave plasma sources and plasma-assisted materials processes. This work focuses on the use of models, including electromagnetic, plasma dynamic, and plasma chemistry models, for the design and control of microwave plasma reactors used for materials processing.

Donnie Reinhard, Professor, Electrical and Computing Engineering at Michigan State University.

Expertise is in the areas of solid state materials and devices, specifically microstructuring (including polishing, etching and laser micromachining) of carbon materials.

Jeff Hopwood, Professor at Northeastern University.

Expertise includes microwave and high-density radio frequency plasma processing and plasma source design, high density inductively coupled plasmas, electron cyclotron resonance plasma generation, and microplasmas.

Who Should Attend?

Industrial process engineers, graduate students and scientists researching the area of plasma based thin film synthesis or anyone wishing to augment their knowledge in these areas is encouraged to attend. To register for the minicourse click here

Pricing

The cost for the minicourse is $500. For students the cost is $250

  • Email: info@icops2006.org